CC Texas Instruments RF Transceiver datasheet, inventory, & pricing. CC The CC is a low cost true single chip UHF transceiver designed for very low power wireless applications. The circuit is mainly intended for the ISM. Highly Integrated MultiCh RF Transceiver Designed for Low-Power Wireless Apps. Datasheet Texas Instruments CC
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By using a single trace the pins are cc1100 longer isolated from each other. The effect of having the two sides with uneven layouts is higher harmonics especially the 2nd and 4th as well as reduced output power at the single-ended side of the filter balun.
Paperback – pages January Don’t let that stop you, there are still datxsheet good articles here! The balanced portion of the filter balun is very susceptible to variations between the two sections. Data is transferred serially through the 1-Wire protocol.
CC Datasheet(PDF) – List of Unclassifed Manufacturers
This service is also offered in conjunction with Design Sources. The layer directly below the components should be a solid ground. The complete file can be obtained from the worldsens cc11100 site.
By taking the time apply these techniques, hopefully, it will save you some layout mistakes and reworks, and thus reduce both development time and costs.
For this reason, it is very important to keep the component spacing and traces as equal as possible. Hardcover – pages August This chip is an inexpensive and very versatile sub-1GHz transceiver that is aimed at ultra-low power wireless applications in a variety of frequency bands. The preferred method is to route bottom side traces on the opposite side of the CC from the RF outputs.
The design of the filter balun accomplishes three main tasks.
The architecture, combined with five low power modes is optimized to achieve extended battery life. A copy of the picture is reproduced below: You can spend all this time and money you save here on designing better firmware for the chip and its associated microcontroller – with the versatility available with the CC, this is where the real excitement should be!
In designing circuits using their components, Texas Instruments’ website provides very helpful documentation and design examples.
Chapter III. WSN Schematic
Conclusion This article, if read in conjunction with the excellent TI application notes for this chip, will make it easier to incorporate the CC into your design. The memory is organized as 16 sectors, each containing pages.
However since that is not possible, the next best approach is to minimize the amount of inductance within the trace by making it as wide datasheft possible based on the size of the component pads. Table of Contents 1. DS provides an absolutely unique identity.
The digitally controlled oscillator DCO allows wake-up from low-power modes to active mode in less than 6ms. In and ideal dataheet, the components would be right next to each other without any traces required to connect them. Paperback – pages, 2nd edition November 2, It is often necessary to switch between layers in order access all of the connections required.
The CC also provides hardware support for packet handling, data buffering, burst transmissions, clear channel assessment, link quality indication, and wake-on-radio.
At the present time Augustthree designs have been published for the CC chip, but the first two are no longer recommended. What the picture does not show is how the supporting components should be placed and routed. As with the filter balun section, the ground plane below the trace must be solid up to the antenna.
The MCP combines constant voltage, constant current regulation, cell preconditioning, cell temperature monitoring, advanced safety timers, automatic charge termination, and charge status and fault indication.
The whole memory can be erased using the Bulk Erase instruction, or a sector at a time, using the Sector Erase instruction.
Originally developed by ChipCon, this chip has continued as an active TI product following their acquisition of ChipCon in early If this is not possible, the trace should be routed directly below the device, but NOT under the RF pads or filter balun. However, the trace widths for the filter balun section itself should be as wide as possible without requiring a resize at the pads of the filter balun components in other words, you should make the traces from the CC to the filter inductors the same width as the CC pads.
The correct procedure is to route an individual trace from each pin to its associated capacitor. Design and layout is an art form, and never more so than when you are designing an RF circuit.
Second it provides a low pass filter. Recommended PCB Layout for QLP 20 Package TI notes that this diagram is an illustration only and not to scale, and that there are five 10 mil via holes distributed symmetrically in the ground pad under the package that are not shown in the diagram. For more information on the Datashee microcontroller, the datasheet can be found at TI.